SMT assembly, PTH assembly, SMT PTH hybrid
FPC manufacturing, component procurement, and turnkey FPC assembly
SOIC、QFP、QFN、BGA、uBGA、CGA、LGA、CSP、 Components as small as 0201
IC programming and FPC testing
Passed ISO9001:2015 ISO 13485: 2016 certification and UL certification
100% AOI, X-RAY, ICT, and FCT
No minimum order quantity and competitive pricing
High frequency and high-speed FPC combines the flexibility and bendability of FPC with the characteristics of high-frequency and high-speed circuits, and has the following significant features:
High frequency performance: Special materials and process design are used to ensure low signal loss and electromagnetic interference during high-frequency signal transmission, meeting the requirements of high-speed data transmission.
High speed transmission: Supports stable transmission of high-speed signals, suitable for high-speed electronic devices that need to process large amounts of data.
Flexibility: It has good flexibility and bendability, can adapt to various complex shapes and space limitations, and provides flexible connection solutions.
High density: capable of arranging more circuits and components in a limited space, improving the integration and signal transmission efficiency of the circuit board.
High frequency and high-speed FPCs are typically composed of multiple layers, including conductive layers, insulating layers, and cover films. The key materials and structural characteristics are as follows:
Conductive layer: Made of high conductivity copper foil material to ensure stable signal transmission. Meanwhile, the thickness and width of the copper foil are precisely designed to meet the requirements of high-frequency and high-speed signal transmission.
Insulation layer: using insulation materials with excellent dielectric and heat resistance properties, such as polyimide (PI) or polyester (PET). These materials can reduce signal loss and interference during transmission, and improve the overall performance of the circuit board.
Cover film: used to protect circuits and components, preventing damage to circuit boards from external environments. The covering film is usually made of the same material as the insulation layer and undergoes special treatment to improve its wear resistance and corrosion resistance.
The manufacturing process of high-frequency and high-speed FPC is relatively complex, requiring high-precision process control and advanced production equipment. It mainly includes the following steps:
Material preparation: Select conductive and insulating materials with excellent high-frequency performance and heat resistance.
Circuit fabrication: High frequency and high-speed circuits are fabricated on substrates through processes such as photolithography and etching. This step requires precise control of the width, spacing, and shape of the circuit to ensure the stability and efficiency of signal transmission.
Layering and Drilling: Layering multiple layers of materials together and drilling holes at desired locations to form electrical connections. During the lamination process, it is necessary to control parameters such as temperature and pressure to ensure a tight bond between the layers and the stability of electrical performance.
Electroplating and surface treatment: Electroplating treatment is applied to drill holes to form a conductive layer, and oxidation and corrosion resistance treatment is applied to the surface of the circuit board. This step helps to improve the reliability and service life of the circuit board.
Cover film bonding and reinforcement: Apply a cover film to the surface of the circuit board to protect the circuit and components, and paste reinforcement materials in areas where support strength needs to be increased. This step helps to improve the overall strength and durability of the circuit board.
Molding and Inspection: Cutting, bending, and other molding processes are carried out on circuit boards, and strict quality inspections are conducted to ensure that they meet design and usage standards. This step is a crucial step in ensuring the quality and performance of the circuit board.
High frequency and high-speed FPCs are widely used in various fields due to their excellent high-frequency performance and flexibility, especially in products that require high signal transmission speed and quality. For example:
Communication equipment: In communication devices such as smartphones, base stations, and routers, high-frequency and high-speed FPCs are used to connect key components such as antennas, RF modules, and baseband chips, achieving high-speed and stable signal transmission.
Computers and peripheral devices: In laptops, tablets, printers, and other computers and peripheral devices, high-frequency high-speed FPCs are used to connect high-speed signal transmission components such as motherboards, graphics cards, and memory, improving data transmission speed and stability.
Automotive electronics: In automotive electronic components such as display screens, sensors, and cameras, the high temperature resistance and vibration resistance of high-frequency and high-speed FPCs enable them to adapt to the complex working environment inside the car, while meeting the requirements of high-speed signal transmission.
Medical equipment: In medical devices such as monitors and endoscopes, the flexibility and high reliability of high-frequency and high-speed FPC enable it to adapt to various complex shapes and space limitations, while ensuring the normal operation of the equipment and the safety of patients.
If pursuing cost-effective FPC manufacturing services, choosing a Chinese manufacturer is the best choice. As a manufacturing powerhouse, China has abundant resources, cheap labor, and a large number of technical personnel. We recommend Haibo, a Chinese FPC assembly service provider with over 10 years of experience, who has performed outstandingly in various aspects
Efficient and reasonable quotation:There is an efficient quotation process to assist you in making decisions, providing reasonable prices and highly competitive quotes in China.
High quality and reliable products:Produce high standard printed circuit boards, manufacture and test according to specifications, international standards, and internal controls, and conduct pre production inspections to ensure robust processes.
Quick and on-time delivery:The assembly equipment is in good condition, with high productivity, minimal downtime, short delivery time, and also provides urgent services.
Timely and effective response:Always respond to customer needs, provide accurate information, answer questions through multiple channels, and offer one-stop services.
Strong technical strength:China's FPC manufacturing technology is leading, and Haibo has a complete SMT solution that covers assembly, inspection, and other capabilities. It also provides prototype production and customization services.
mobile phone: 86-15113315665
Contact: Chen Changhai
mobile phone: 86-18676922028
E-mall: haibo_fpcba1668@163.com
Address: 3rd Floor, Building 2, Fuxing Industrial Park, Building B, Chuangye 1st Road, Jiangbian Community, Songgang Street, Bao'an District, Shenzhen