SMT assembly, PTH assembly, SMT PTH hybrid
FPC manufacturing, component procurement, and turnkey FPC assembly
SOIC、QFP、QFN、BGA、uBGA、CGA、LGA、CSP、 Components as small as 0201
IC programming and FPC testing
Passed ISO9001:2015 ISO 13485: 2016 certification and UL certification
100% AOI, X-RAY, ICT, and FCT
No minimum order quantity and competitive pricing
HDI soft hard bonding board is a circuit board that combines HDI technology with soft hard bonding board technology to form a high-density interconnect characteristic, while also possessing both rigidity and flexibility. It usually consists of rigid regions, flexible regions, and transition regions connecting these regions, which can meet complex three-dimensional assembly and high-density connection requirements.
High density interconnection: HDI technology greatly increases the density of lines and vias on circuit boards, thereby improving the integration and signal transmission speed of circuit boards.
Rigid flexible combination: The rigid region provides stable support and connection, while the flexible region allows the circuit board to freely bend and fold in three-dimensional space, adapting to various complex shapes and structural requirements.
Improved performance: HDI soft hard integrated boards have smaller line widths and spacing, lower impedance losses, and more complete signal transmission quality, thereby improving the overall performance of the circuit board.
Reduce volume and weight: By optimizing the circuit layout and stacking structure, HDI soft hard composite boards can reduce volume and weight while maintaining high performance.
High reliability: HDI soft hard composite board adopts advanced manufacturing technology and materials, with higher reliability and stability, suitable for various harsh application environments.
The manufacturing process of HDI soft hard composite board is relatively complex, involving multiple steps and fine operations. The main processes include:
Design: Use advanced CAD software for circuit design, ensuring precise docking between rigid and flexible areas and achieving high-density interconnection.
Material selection: Choose suitable substrates and conductive materials according to product requirements, such as rigid substrates like polyimide (PI) and FR4, as well as flexible materials like transparent conductive films.
Making conductive layer: Using photolithography, electroplating and other processes to create conductive patterns and vias on the substrate.
Layering and Drilling: The rigid and flexible layers are laminated and mechanically drilled at designated locations for subsequent installation of components or interlayer connections.
Electroplating and surface treatment: Electroplating treatment is applied to the exposed copper surface to enhance welding performance and prevent oxidation.
Testing and Inspection: Conduct circuit connectivity and functional testing to ensure product quality meets standards.
HDI soft hard composite board is widely used in various fields due to its unique performance and advantages:
Smartphones and tablets: used to connect display screens, camera modules, sensors, and other components to improve device integration and performance.
Wearable devices, such as smartwatches, fitness trackers, etc., utilize the flexible characteristics of HDI soft hard combination boards to achieve lightweight and comfortable wearing of the devices.
Automotive electronics: used for connecting components such as car displays, sensors, controllers, etc., to meet the complex working environment and high reliability requirements inside automobiles.
Medical equipment: HDI soft and hard combination boards are often used in the signal transmission part, control module, etc. of medical equipment to meet special requirements for space and shape.
Aerospace: In the navigation and control circuit of aircraft or drones, HDI soft and hard integrated boards can provide stable and reliable electrical performance, meeting the reliability requirements in harsh environments.
If pursuing cost-effective FPC manufacturing services, choosing a Chinese manufacturer is the best choice. As a manufacturing powerhouse, China has abundant resources, cheap labor, and a large number of technical personnel. We recommend Haibo, a Chinese FPC assembly service provider with over 10 years of experience, who has performed outstandingly in various aspects
Efficient and reasonable quotation:There is an efficient quotation process to assist you in making decisions, providing reasonable prices and highly competitive quotes in China.
High quality and reliable products:Produce high standard printed circuit boards, manufacture and test according to specifications, international standards, and internal controls, and conduct pre production inspections to ensure robust processes.
Quick and on-time delivery:The assembly equipment is in good condition, with high productivity, minimal downtime, short delivery time, and also provides urgent services.
Timely and effective response:Always respond to customer needs, provide accurate information, answer questions through multiple channels, and offer one-stop services.
Strong technical strength:China's FPC manufacturing technology is leading, and Haibo has a complete SMT solution that covers assembly, inspection, and other capabilities. It also provides prototype production and customization services.
mobile phone: 86-15113315665
Contact: Chen Changhai
mobile phone: 86-18676922028
E-mall: haibo_fpcba1668@163.com
Address: 3rd Floor, Building 2, Fuxing Industrial Park, Building B, Chuangye 1st Road, Jiangbian Community, Songgang Street, Bao'an District, Shenzhen