Drilling of solder pads → Copper plating inside holes → Resin plugging → Curing → Polishing → Copper reduction → Stripping → Drilling of other non via solder pad holes (usually component holes, fixture holes) → Copper plating and VIP surface copper → Other normal processes.

The vacuum resin sealing process usually uses VIPPO technology.

The VIPPO sealing method is a revolutionary technology that provides PCB designers with excellent performance and reliability. This method allows for fast, efficient, and cost-effective assembly of PCBs without the need for solder paste or traditional through-hole assembly techniques. The POFV through-hole plating process on solder pads also eliminates the risk of thermal damage associated with soldering, and due to the smaller diameter of the through-hole, allows for higher component density to be installed on PCBs, making it an ideal choice for high-density applications such as smartphones, tablets, and other consumer electronics devices.

The VIPPO plug hole process can assemble PCBs without the need for solder paste or traditional through-hole assembly techniques. In this process, the conductive vias are integrated into the printed circuit board, and then filled with non-conductive materials such as epoxy resin or insulating gel. It creates a practical and safe plug that can connect electrical components to circuit boards without the need for traditional through-hole assembly techniques. In addition, the through-hole diameter used in this method is smaller than traditional through-hole assembly methods, allowing designers to increase the density of components on the PCB. Therefore, the POFV plug hole method provides excellent performance and reliability for PCB designers, making it an ideal choice for high-density applications.

People interested in VIPPO technology may ask, 'If my PCB requires drilling holes on solder pads and soldering electronic components on them, do I need to use VIPPO technology or SKIPPO?' Yes, you understand. By the way, VIPPO and SKIPPO (Skip Via in Pad Plated over) are commonly used for through holes in BGA solder pads.

Many people may wonder, "What if there are through holes on the solder pads and VIPPO is not printed on the PCB If POFV is not drilled on the via holes on the solder pad, it means that not plugging the via holes will result in a small welding area, leading to tin ball hole accumulation or oil explosion, resulting in welding failure.

It is best not to exceed 0.5mm in VIPPO aperture, otherwise solder paste is prone to flow into the hole, or during heating, solder flux is prone to flow into the hole, causing gas inside the hole and resulting in insufficient connection strength.

The production process of through-hole coating is shown in the following figure. The difference between VIPPO through-hole and regular through-hole is that it has a copper cap that is flush with the solder pad.

If VIPPO technology is used for PCB, the cost will increase by 15% -25%, and the solder pads are more prone to detachment than conventional pads, so it is recommended to choose packages with larger pin spacing. Some people may ask, "Why do we still use Platform Over Filled Via to plug holes?" This is because VIPPO technology greatly improves the wiring density of PCBs, especially in BGA areas, while also eliminating capacitance effects. Usually, the formation below BO/BO will produce capacitive effects. VIPPO technology eliminates the capacitance effect.

In addition, we suggest using through-hole plating technology combined with back drilling process, which can well meet the requirements of high-density and high-speed signal products.

So whether to adopt VIPPO technology or not requires a comprehensive evaluation based on the characteristics of the product.

There are tens of thousands of resin plug holes on a PCB, and it is not allowed for any hole to be incomplete. Someone wants to know if PCB manufacturers require rigorous thinking and standardization of VIPPO process before plugging holes The answer is yes, because even a defect of one in ten thousand can lead to a probability of being scrapped.

Of course, good plug hole equipment is necessary. Currently, VIPPO uses two types of plug hole equipment: vacuum plug hole machines and non vacuum plug hole machines.

VIPPO via pad coating technology:Simply put, after copper is applied to the wall of the hole, the guide hole is filled with epoxy resin, then the surface is polished, and finally copper plated on the surface. The cost is relatively high. It should be noted that some blind hole products have a blind hole layer thickness exceeding 0.5mm, and the pressed PP adhesive cannot fill the blind hole. It is also necessary to fill the blind hole with resin to avoid the problem of no copper in the blind hole in subsequent processes.

The difference between solder mask plug hole technology and plating filling hole technology:Before the widespread adoption of VIPPO plug hole technology, high-frequency PCB manufacturers generally used the simpler process of solder mask plug hole technology. However, when solder mask plug holes are used, the solder oil will shrink after solidification, which easily leads to hole explosion problems and cannot meet customers' requirements for high hole fullness.

On the other hand, VIPPO plug hole technology uses resin to plug blind holes, followed by a pressing process, perfectly solving the drawbacks of solder mask plug holes and balancing the contradiction between controlling the thickness of the pressing medium layer and the early design of the inner blind hole sealing and filling. Therefore, although VIPPO plug hole technology has a relatively complex process and high cost, the fullness and quality of plug holes will be more advantageous than solder mask plug holes.

Solder plug hole technology:Solder plug holes are used as ordinary vias on PCBs; After passing through the solder mask, there is solder oil on the surface, which cannot conduct electricity. General requirements after plugging:

A. Please make sure to fill in.

B. No redness or false copper exposure is allowed.

C. It is not allowed for the plug-in to be too neat and cause protrusions that protrude from nearby solder pads, which may affect SMT installation.

VIPPO can improve welding reliability. Some customers, considering delivery time and cost, usually do not use VIPPO technology for plug holes, but instead use solder mask plug holes. The result caused tremendous pressure on the subsequent welding, leading to an increase in defect rates and a decrease in welding reliability.

VIPPO technology can improve the work efficiency of PCB designers and increase the yield rate of PCBs. Because in PCB design, vias can take up too much space, making wiring difficult, designers have to use extremely small traces of 3.5mil or smaller. Therefore, this will increase production difficulty and cost. But if the through-hole is drilled on the solder pad, it can save a lot of space. Therefore, designers can use more space for wiring.

For high-frequency PCBs, VIPPO technology is suitable for performance and has better electrical performance. The details are as follows: It allows for unprecedented integration, flexibility, and scalability. This advanced technology can create high-performance printed circuit boards with higher performance and efficiency, thereby shortening the time to market and improving product design.

Electroplating through holes in solder pads will increase the cost of PCB.

A. There are bubbles inside the orifice.

B. The plug hole is incomplete.

C. Layering of resin and copper.

A. If there are bubbles in the hole, it is impossible to make solder pads; Gas accumulation and blowing at the hole during chip soldering, also known as out gassing.

B. Incomplete plug holes can result in no copper. In addition, if the plug hole is incomplete, there will be bubbles inside the hole, which are easy to absorb moisture, so the PCB may explode when passing through the soldering furnace. And if there are bubbles inside the hole when plugging, the bubbles will squeeze out the resin during the baking process, causing one side to be concave and the other side to be convex. So it is necessary to ensure that defective products can be detected. Boards with bubbles may not necessarily burst, because the main cause of bursting is moisture. Therefore, if it is a board that has been baked during installation or a board that has just left the factory, it generally will not cause bursting.

C、 Resin and copper delamination can cause protrusions on the solder pads, resulting in weak soldering or component detachment.

Choosing the appropriate resin is crucial for pore plugs, especially in terms of the TG value and expansion coefficient of the resin material. The appropriate production process and debonding parameters are also crucial to avoid delamination between the resin and copper after heating.

Utilizing the latest advancements in electronic design automation to maximize efficiency and reliability

Perform a detailed visual inspection of each PCB using Automatic Optical Inspection (AOI) testing

Implement functional testing to ensure that each board operates properly.

Invest in top quality control systems, continuously improve and prevent defects

Establish preventive measures to detect potential production errors before they occur

Having an experienced professional team with expertise in electronic engineering, materials science, and manufacturing processes

Continuously researching new technologies and materials to further improve product performance and reliability

A. There will be a board explosion problem.

B. There is resin protrusion or unevenness inside the blind hole.

C. There is no copper inside the hole.

A、 Any of the above quality issues should not be taken lightly, otherwise it will result in the product being scrapped.

B. Some people may ask, 'Will protruding or uneven resin cause uneven circuits, leading to open or short circuits?' Yes, it can cause these problems.

Friends familiar with the PCB industry may share the same feeling, 'Is controlling the fullness of the inner HDI plug holes useful for preventing or improving board bursting?' Of course, it makes sense!

If you choose to plug holes after the circuit process, the time from plug holes to lamination process must be well controlled, and the board surface must be carefully cleaned.

Experienced readers may add, "When plugging holes, it is important to control the polishing and flatness of the resin to prevent resin protrusion, right?" Yes, you are right.

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