CEM1、CEM3、FR4、 High TG FR4, high-speed FR4, high-frequency FR4, ceramics PTFE、RO4350、RO4003、 Aluminum, copper based, aluminum oxide, PET, etc.
Material thickness: 0.5-10.0mm
Copper thickness (oz): 1/3 oz to 20 oz
Passed ISO9001: In 2015 ISO13485: 2016 certification and UL certification
IPC 600 Level 2 and Level 3
100% electronic testing, AOI inspection, and visual inspection
众所周知,由于世界技术发展迅速,对 PCB 的需求日益增加,而这种新兴技术对现代设备的需求也在迅速增加。为了满足对电子设备日益增长的需求,PCB 的制造也在增加。我们知道 PCB 有很多种类型,从单面 PCB 到多层 PCB,其中最著名的是双面 PCB 板。在本文中,我们将了解双面 PCB 板的所有基础知识,包括其基本结构、历史、基本制造工艺以及它们在全球的新兴市场。
双面 PCB 的两面都有两个导电铜层(一个在顶部,另一个在底部)。这些铜层为箔片形式,附着在介电材料的两侧。该介电材料构成 PCB 的基板。介电材料通常是一种 FR4 树脂材料(或其他材料),它被封装在两个铜层之间。它为 PCB 提供稳定性和刚性。两个铜层上还涂有阻焊层,以防止它们受到腐蚀和其他环境因素的影响。两层之间还钻有镀通孔(过孔),以便在不同层之间提供电连接。
双面 PCB 制造商制造电路板,用于生产从初学者级原型到工业级产品的电子设备。双面设计不如多层 PCB 密集。但它们比多层 PCB 更具成本效益。然而,与单面 PCB 相比,它们仍然在较小的电路板尺寸上提供更复杂的电路。
构成双面印刷电路板的几个关键组件如下:BGA封装具有出色的散热性,能够将芯片产生的热量传导至PCB以减轻潜在的过热。
走线是使用 PCB 两面的铜层建立的电气连接。布线是在各种电气元件之间布置这些铜连接的过程。在设计双面 PCB 板时,必须考虑走线的阻抗以及其轨道宽度和尺寸。
焊接和固定元件的金属 PCB 表面称为焊盘。焊盘便于在电路板上焊接元件。PCB 设计中的重要考虑因素包括焊盘的大小、形状和位置,因为这会影响设备的整体可靠性和质量。元件的可焊性、稳定性和热传递也会受到电路板布局和设计的影响。
过孔是镀通孔,用于在两层之间建立电气连接。虽然它们在层之间建立了联系,但它们也具有特定的制造成本。需要仔细考虑过孔的放置想法,因为它可能会影响电路板的整体性能。此外,它们对信号传播有显著影响。因此,需要正确选择和放置过孔。
焊料必须具有绿色层,该层出现在 PCB 的两侧。该阻焊层有助于防止走线之间发生短路,并防止铜走线氧化。该层还可以保护 PCB 免受灰尘、烟雾和湿气等外部环境因素的影响。
铜焊盘需要覆盖一层金属层以避免氧化并增强可焊性,这称为表面处理。双层 PCB 最常用的表面处理是 HAL、OSP、ENIG、浸锡和浸银。
It has been proven that double-layer PCBs are one of the best PCBs in the field of electronic products. Although the manufacturing cost of double-sided PCBs is slightly higher than single-sided PCBs, they can provide more compact and dense circuit designs that single-sided PCBs cannot achieve. Here are their main advantages:
Since we can place components on both sides of the PCB, there is enough space available for our purposes, so space availability is an important factor compared to single-sided PCBs
We have two layers for wiring, which is beneficial for critical and high-speed design, providing better signal integrity
This double-sided PCB board provides a more flexible design as components can be easily switched from bottom to top or from top to bottom.
This type of double-layer PCB has a certain degree of complexity in design, but they are more cost-effective than multi-layer PCBs
The circuit complexity of double-sided PCB boards is slightly higher, but they are not suitable for designing high-speed circuits and critical radio frequency (RF) circuits.
Double sided PCBs cannot handle excessive current because their copper wires generate heat, making them unsuitable for high current absorption circuits.
Due to our production of double-sided PCBs, it takes more time to manufacture and produce double-layer PCBs.
If there are more types of signals in the circuit (such as analog signals, digital signals, power signals, and RF signals), wiring on two layers will be more difficult, so we need multi-layer PCBs.
Double sided PCB boards are more commonly used in power supply design for electronic devices, such as SMPS, LED driver circuits, mobile phones, remote controls, printers, etc.
Double layer PCBs are most commonly used in engine management systems and battery management systems. They are also used as control devices for vehicle C-type and D-type management systems
Double sided printed circuit boards are mainly used in the production of most industrial equipment used in the manufacturing process of products.
Double sided PCB is also used for designing network circuits, including routers, communication switches, protocol networks, etc
Double sided PCB manufacturing involves executing various steps in a serial manner to produce high-quality double-sided printed circuit boards:
Double sided PCB manufacturers can use various software to design circuits, which are used to draw schematic and layout designs for PCB boards. In the case of double-sided PCB, circuit design is accomplished by forming copper traces on two layers (top and bottom). The Gerber files for layout design will be generated through PCB software and used to print the required circuits on a double-sided PCB board.
The dielectric material of double-sided printed circuit boards is usually made of FR4 resin. This FR4 resin is composed of a grid of glass frames woven together. This glass structure is combined with resin to form a material called prepreg. FR4 dielectric material and copper foil are attached to both sides of the substrate material through heat treatment and cut into the required blocks for production, typically 18 x 24 inches.
The process of printing the required circuit on copper foil is called photolithography. During this process, a photosensitive material is used to cover the copper foil, and then the required circuit is engraved in the form of a photomask. Using ultraviolet light, it will pass through this photomask layer and project onto the copper foil. Through this process, the desired circuit pattern will be formed on the PCB.
During this process, the exposed copper will be immersed in etching chemicals, and under the action of these chemicals, the photosensitive material will remove all the exposed copper, leaving behind the copper wire required for the circuit.
In order to form mounting holes and vias on the PCB, it is necessary to use a drilling machine to generate holes of various diameters on the PCB. Installation holes are non plated through holes, while vias are plated through holes filled with copper to create electrical connections.
During this process, both sides of the PCB will be coated with a polymer protective layer, usually green. This layer of PCB can prevent copper wire corrosion and also protect the circuit board from environmental factors such as dust, smoke, and moisture. It can also prevent the formation of solder bridges during component installation.
During this process, white ink is used to generate symbols for indicators and components to be soldered onto the PCB. This screen printing process can also be used to print any type of desired logo.
For copper areas not covered by solder mask, we need to cover them with a thick layer of metal to prevent oxidation. In addition, this helps with the soldering of components on the PCB.
After the PCB is completed, thorough testing and inspection are always required, such as open and short circuit testing, AOI inspection, visual inspection, solderability testing, intermediate section and inspection.
If pursuing cost-effective FPC manufacturing services, choosing a Chinese manufacturer is the best choice. As a manufacturing powerhouse, China has abundant resources, cheap labor, and a large number of technical personnel. We recommend Haibo, a Chinese FPC assembly service provider with over 10 years of experience, who has performed outstandingly in various aspects
Efficient and reasonable quotation:There is an efficient quotation process to assist you in making decisions, providing reasonable prices and highly competitive quotes in China.
High quality and reliable products:Produce high standard printed circuit boards, manufacture and test according to specifications, international standards, and internal controls, and conduct pre production inspections to ensure robust processes.
Quick and on-time delivery:The assembly equipment is in good condition, with high productivity, minimal downtime, short delivery time, and also provides urgent services.
Timely and effective response:Always respond to customer needs, provide accurate information, answer questions through multiple channels, and offer one-stop services.
Strong technical strength:China's FPC manufacturing technology is leading, and Haibo has a complete SMT solution that covers assembly, inspection, and other capabilities. It also provides prototype production and customization services.
mobile phone: 86-15113315665
Contact: Chen Changhai
mobile phone: 86-18676922028
E-mall: haibo_fpcba1668@163.com
Address: 3rd Floor, Building 2, Fuxing Industrial Park, Building B, Chuangye 1st Road, Jiangbian Community, Songgang Street, Bao'an District, Shenzhen