SMT assembly, PTH assembly, SMT PTH hybrid
FPC manufacturing, component procurement, and turnkey FPC assembly
SOIC、QFP、QFN、BGA、uBGA、CGA、LGA、CSP、 Components as small as 0201
IC programming and FPC testing
Passed ISO9001:2015 ISO 13485: 2016 certification and UL certification
100% AOI, X-RAY, ICT, and FCT
No minimum order quantity and competitive pricing
Definition: Blind hole FPC refers to a flexible printed circuit board that includes both buried holes located inside the board and not connected to the outer layer, as well as blind holes that enter from one side without penetrating the entire board thickness. This circuit board combines the advantages of buried holes and blind holes, achieving more complex and efficient electrical connections.
Efficient space utilization: The buried holes are completely located inside the circuit board and do not occupy the surface space of the circuit board, while blind holes only connect specific inner and outer layers, effectively saving space.
Complex electrical connections: Buried blind hole FPC can achieve complex electrical connections between multi-layer circuit boards, improving the integration and performance of the circuit board.
Excellent signal integrity: The buried hole provides a short and straight path for signals between the inner layers, helping to reduce signal loss and electromagnetic interference, and improve signal integrity.
High reliability and stability: The buried blind hole technology makes the structure of the circuit board more robust, improving the mechanical strength and thermal stability of the circuit board.
Structure: Blind hole FPC is usually composed of multiple layers, including conductive layers, insulation layers, and cover films. The buried holes are located between these layers, while blind holes enter from one side and end at a certain depth.
Conductive layer: Made of high conductivity copper foil material to ensure stable signal transmission.
Insulation layer: Insulation materials with excellent dielectric and heat resistance properties, such as polyimide (PI) or polyester (PET), are used to protect conductive lines and prevent signal interference.
Cover film: used to protect circuits and components, preventing damage to circuit boards from external environments.
The manufacturing process of blind hole FPC is relatively complex, mainly including the following steps:
Inner layer circuit fabrication: Inner layer circuits are fabricated on the substrate, and predetermined circuit patterns are formed through processes such as photolithography and etching.
Burial hole fabrication: Use laser or mechanical methods to create buried holes at designated locations. This step requires precise control of the depth and position of the borehole to ensure that the buried hole can be correctly connected to the designated inner line.
Blind hole production: To produce blind holes at the required locations, precise control of the drilling depth and position is also required.
De drilling and metalization: After drilling, there will be some impurities such as drill cuttings and oil stains remaining on the hole wall, which need to be treated for de drilling. Afterwards, metallization treatments such as electroless copper plating and electroplated copper are carried out to form a conductive layer on the hole wall.
Layering and Outer Circuit Manufacturing: Layering multiple layers of materials together and creating conductive circuits on the outer layer. This step requires ensuring tight bonding between layers and stable electrical performance.
Surface treatment and cover film bonding: Apply anti-oxidation treatment to the surface of the circuit board and bond the cover film at designated locations to protect the circuit.
Molding and Inspection: Cutting, bending, and other molding processes are carried out on circuit boards, and strict quality inspections are conducted to ensure that they meet design and usage standards.
Blind hole FPC is widely used in various fields due to its unique characteristics and advantages, especially in products that require high signal transmission speed and quality. For example:
Communication equipment: In communication devices such as smartphones and tablets, blind hole FPC is used to connect key components such as antennas and RF modules, achieving high-speed and stable signal transmission.
Computers and peripherals: In laptops, printers, and other computers and peripherals, blind hole FPC is used to connect high-speed signal transmission components such as motherboards and graphics cards.
Automotive electronics: In automotive electronic components such as display screens and sensors, the high temperature resistance and vibration resistance of blind hole FPC enable it to adapt to the complex working environment inside the car.
Medical equipment: In medical devices such as monitors and endoscopes, the flexibility and high reliability of blind hole FPC enable it to adapt to various complex shapes and space limitations.
If pursuing cost-effective FPC manufacturing services, choosing a Chinese manufacturer is the best choice. As a manufacturing powerhouse, China has abundant resources, cheap labor, and a large number of technical personnel. We recommend Haibo, a Chinese FPC assembly service provider with over 10 years of experience, who has performed outstandingly in various aspects
Efficient and reasonable quotation:There is an efficient quotation process to assist you in making decisions, providing reasonable prices and highly competitive quotes in China.
High quality and reliable products:Produce high standard printed circuit boards, manufacture and test according to specifications, international standards, and internal controls, and conduct pre production inspections to ensure robust processes.
Quick and on-time delivery:The assembly equipment is in good condition, with high productivity, minimal downtime, short delivery time, and also provides urgent services.
Timely and effective response:Always respond to customer needs, provide accurate information, answer questions through multiple channels, and offer one-stop services.
Strong technical strength:China's FPC manufacturing technology is leading, and Haibo has a complete SMT solution that covers assembly, inspection, and other capabilities. It also provides prototype production and customization services.
mobile phone: 86-15113315665
Contact: Chen Changhai
mobile phone: 86-18676922028
E-mall: haibo_fpcba1668@163.com
Address: 3rd Floor, Building 2, Fuxing Industrial Park, Building B, Chuangye 1st Road, Jiangbian Community, Songgang Street, Bao'an District, Shenzhen