SMT assembly, PTH assembly, SMT PTH hybrid
FPC manufacturing, component procurement, and turnkey FPC assembly
SOIC、QFP、QFN、BGA、uBGA、CGA、LGA、CSP、 Components as small as 0201
IC programming and FPC testing
Passed ISO9001:2015 ISO 13485: 2016 certification and UL certification
100% AOI, X-RAY, ICT, and FCT
No minimum order quantity and competitive pricing
Micro porous FPC is a type of circuit board that uses advanced drilling technology to form a small aperture on the basis of traditional FPC. These small apertures can be through holes or blind holes, used to achieve electrical connections between different layers. Micro porous FPC has the characteristics of small aperture, high precision, and high wiring density, which can meet the demands of modern electronic devices for high performance, miniaturization, and lightweight.
The manufacturing process of microporous FPC mainly includes the following steps:
Substrate preparation: Select a suitable flexible substrate, such as polyimide or polyester film, and clean and treat it.
Drilling: Advanced drilling techniques such as laser drilling, plasma etching, or chemical etching are used to form tiny pores on the substrate. These techniques can ensure the accuracy and consistency of aperture, while reducing damage to the substrate.
Circuit fabrication: Coating or depositing conductive material on the substrate after drilling to form a conductive layer. Then, the required circuit patterns are fabricated through processes such as photolithography and etching.
Cover film bonding and reinforcement: The cover film is bonded to the surface of the circuit to protect it, and reinforcement materials are attached to areas where support strength needs to be increased.
Cutting and Forming: Cut and form FPC according to design requirements to meet practical application needs.
Testing and Inspection: Conduct testing and inspection on the completed microporous FPC to ensure its quality and performance meet the requirements.
Micro porous FPC is widely used in various electronic devices that require high performance, miniaturization, and lightweight due to its unique performance characteristics. For example:
Mobile devices: In mobile devices such as smartphones and tablets, micro hole FPC is used to connect components such as display screens, cameras, fingerprint recognition modules, etc., to achieve stable signal transmission and high-speed response.
Wearable devices: In wearable devices such as smartwatches and smart glasses, the flexible characteristics of micro porous FPC enable it to adapt to various complex shapes and space limitations, achieving compact design and comfortable wearing of the device.
Automotive electronics: In the connection of components such as car displays, sensors, cameras, etc., the high temperature resistance and vibration resistance of micro porous FPC make it suitable for the complex working environment inside the car.
Medical electronics: In small medical devices such as medical monitors and hearing aids, the flexibility and high reliability of micro porous FPC enable it to meet special requirements for space and shape, while ensuring the safe and reliable operation of the equipment.
The technical advantages of microporous FPC lie in its high performance, miniaturization, and lightweight characteristics, which can meet the demand of modern electronic devices for high-performance connections. However, the manufacturing process of microporous FPC is relatively complex, requiring high-precision process control and equipment support. In addition, with the rapid development and accelerated upgrading of electronic products, the performance requirements for micro porous FPC are also increasing, and traditional manufacturing processes are facing many challenges.
To address these challenges, manufacturers need to continuously develop and innovate new manufacturing processes and technologies to improve the production efficiency and accuracy of micro porous FPCs. At the same time, it is necessary to strengthen quality control and testing methods to ensure that the quality and performance of microporous FPC meet practical application requirements.
If pursuing cost-effective FPC manufacturing services, choosing a Chinese manufacturer is the best choice. As a manufacturing powerhouse, China has abundant resources, cheap labor, and a large number of technical personnel. We recommend Haibo, a Chinese FPC assembly service provider with over 10 years of experience, who has performed outstandingly in various aspects
Efficient and reasonable quotation:There is an efficient quotation process to assist you in making decisions, providing reasonable prices and highly competitive quotes in China.
High quality and reliable products:Produce high standard printed circuit boards, manufacture and test according to specifications, international standards, and internal controls, and conduct pre production inspections to ensure robust processes.
Quick and on-time delivery:The assembly equipment is in good condition, with high productivity, minimal downtime, short delivery time, and also provides urgent services.
Timely and effective response:Always respond to customer needs, provide accurate information, answer questions through multiple channels, and offer one-stop services.
Strong technical strength:China's FPC manufacturing technology is leading, and Haibo has a complete SMT solution that covers assembly, inspection, and other capabilities. It also provides prototype production and customization services.
mobile phone: 86-15113315665
Contact: Chen Changhai
mobile phone: 86-18676922028
E-mall: haibo_fpcba1668@163.com
Address: 3rd Floor, Building 2, Fuxing Industrial Park, Building B, Chuangye 1st Road, Jiangbian Community, Songgang Street, Bao'an District, Shenzhen