High current carrying capacity: Due to the increase in copper foil thickness, thick copper plates can carry larger currents, making them suitable for high-power circuits and situations that require large currents to pass through.
Good heat dissipation performance: Thick copper plates have better heat dissipation performance, which can effectively reduce the heat generated by circuits during operation, and improve the reliability and stability of circuits.
High mechanical strength: The thicker copper foil layer gives the PCB higher mechanical strength, allowing it to withstand greater external forces and pressures, making it suitable for applications that require higher mechanical strength.
Corrosion resistance: The thick copper foil layer can provide better corrosion resistance and extend the service life of the PCB.
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