Common defects in PTH assembly and their avoidance methods-深圳市海博精密电路有限公司

The assembly of through-hole PCBs follows quality standards to maintain and improve quality. The IPC standard specifies measures and guidelines for the electrical and assembly requirements of THT assembly. IPC also provides a set of standards for visual quality and manufacturing standards. SMT and THT assembly may produce different types of defects due to significant differences in materials, component types, processes, and parameter control between these two technologies.

The following is a list of potential defects that through-hole PCB assembly manufacturers must pay attention to and take appropriate control of:

Component lifting:During the wave soldering process, components may be disturbed, leading to component warping. Changes in lead length can also cause components to warp. The factors that affect the length and angle of the lead include lead material, diameter, and hardness.

Missing components:This defect refers to the component not being located in its expected position. This may be due to incorrect settings or improper picking and placement of components during assembly. Missing components can be easily corrected online.

Wrong direction:This situation occurs when the placement direction of components is opposite to the assumed direction in the PCB layout.

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