2、 Manufacturing process-深圳市海博精密电路有限公司

The manufacturing process of multi-layer FPC is relatively complex, mainly including the following steps:
Manufacturing inner layer circuits: Manufacturing inner layer circuits on a substrate and forming predetermined circuit patterns through processes such as photolithography and etching.
Layering process: The produced single-layer circuit board is stacked layer by layer with pre impregnated material according to design requirements and laminated at high temperature and high pressure to form a multi-layer structure.
Drilling and plating holes: Precise drilling equipment is used to drill holes at the required positions, and then electroplating is carried out to form a conductive layer on the hole wall, achieving electrical connection between each layer.
Surface treatment and screen printing: Anti oxidation treatment is applied to the surface of multi-layer boards, and solder mask layers and character markings are screen printed at designated locations to protect circuits from short circuits and facilitate subsequent assembly.
Forming and inspection: After cutting, bending and other steps, the FPC circuit board is finally formed according to the product form requirements, and undergoes strict quality inspection to ensure compliance with design and usage standards.

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