After the gold plating is completed, the wires are removed by milling and etching, but the products made by this process will have residual leads around the PCB gold fingers inside the PCB board, causing exposed copper, which cannot meet the requirement of not allowing exposed copper.
However, the leads of the inner or outer circuit of the PCB connected to the gold finger have been electroplated with gold fingers, so copper exposure around the gold finger should be avoided. But when the circuit density is high, the circuits inside the PCB are very few and dense. So using this technology will not keep the leads inside the circuit layer; This technology is powerless to isolate the golden finger (which is not connected to any circuit).
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