High thermal stability: The thermal decomposition temperature of non adhesive polyimide is usually above 500 ℃, which can maintain stable physical and chemical properties in high temperature environments.
Excellent electrical performance: Non adhesive polyimide has extremely low dielectric constant and dielectric loss, as well as high dielectric strength, making it an ideal choice for electrical insulation materials.
Good mechanical strength: Non adhesive polyimide has high tensile strength and toughness, can resist external impact and tearing, and is suitable for use in harsh environments.
Chemical stability: Non adhesive polyimide has good stability against most chemical substances and is not easily corroded or dissolved.
Low water absorption rate: Non adhesive polyimide has a low water absorption rate, which helps maintain its electrical and mechanical properties in humid environments.
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