The difference between lead and lead-free FPC assembly-深圳市海博精密电路有限公司

Please refer to the following main differences between lead FPC assembly and lead-free FPC assembly (also known as RoHS FPC assembly):

For lead-free FPC assembly, the most important difference between lead soldering and lead-free soldering is environmental friendliness. Lead containing solder paste is not environmentally friendly because it contains lead (Pb), which is highly toxic to the human body.

The metal elements in lead containing tin are tin: 61.9%, lead: 38.1%, more generally speaking: tin: 60%, lead: 40%. The most widely used lead-free solder for lead-free FPC assembly is SAC30. SAC305 represents 96.5%, silver: 3%, copper: 0.5%. But what we need to know is that the lead-free FPC assembly process cannot be 100% lead-free, but the lead element should be less than 1000ppm (<0.1%), which meets the acceptable standards of RoHS and REACH

The melting point of lead tin is 180-190 degrees Celsius, and the working temperature is about 240-260 degrees Celsius. The melting point of lead-free tin used for lead-free FPC assembly is 210-230 degrees Celsius, and the working temperature is 250-280 degrees Celsius. But now solder suppliers have also developed low-temperature solder that can melt below 200 degrees Celsius.

The price of lead-free solder is relatively expensive because the substrate in lead-free solder is relatively expensive.

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