FPC
MPI glue-free polyimide
3、 Application Fields 3、 Application Fields

MPI adhesive free polyimide is widely used in multiple fields due to its unique performance characteristics:
Aerospace: Used for manufacturing electrical components and structural materials in high-temperature working environments, meeting the demand for high-performance materials in the aerospace industry.
Microelectronics: As a high-performance insulation layer and protective layer, it is widely used in integrated circuits, chip packaging, and other fields to improve the reliability and stability of microelectronic devices.
Flexible display: Utilizing its excellent flexibility and transparency, it is used to manufacture flexible display screens and substrates for wearable electronic devices, promoting the development of flexible display technology.
In other high-tech fields such as new energy, medical devices, environmental protection, etc., MPI non adhesive polyimide also shows a wide range of application prospects.

  • 1、 Definition and Structure1、 Definition and Structure
  • 2、 Performance characteristics2、 Performance characteristics
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