Structure: High temperature resistant FPC is usually composed of one or more flexible substrates, with copper foil embedded as a conductive layer to form flexible circuit channels. In addition, it may also include protective layers such as cover films to improve the reliability and service life of the circuit board.
Substrate: Thin film materials such as polyimide (PI) or polyester (PET), among which polyimide has higher high temperature resistance and mechanical strength.
Conductive layer: A high conductivity copper foil material used for transmitting signals and currents.
Cover film: A high-temperature resistant protective film, such as polyimide cover film, used to protect circuits and components from external environmental damage.
mobile phone: 86-15113315665
Contact: Chen Changhai
mobile phone: 86-18676922028
E-mall: haibo_fpcba1668@163.com
Address: 3rd Floor, Building 2, Fuxing Industrial Park, Building B, Chuangye 1st Road, Jiangbian Community, Songgang Street, Bao'an District, Shenzhen