FPC
HT-resistant FPC
2、 Structure and Materials 2、 Structure and Materials

Structure: High temperature resistant FPC is usually composed of one or more flexible substrates, with copper foil embedded as a conductive layer to form flexible circuit channels. In addition, it may also include protective layers such as cover films to improve the reliability and service life of the circuit board.

Material Science:

Substrate: Thin film materials such as polyimide (PI) or polyester (PET), among which polyimide has higher high temperature resistance and mechanical strength.
Conductive layer: A high conductivity copper foil material used for transmitting signals and currents.
Cover film: A high-temperature resistant protective film, such as polyimide cover film, used to protect circuits and components from external environmental damage.

  • 1、 Definition and Characteristics1、 Definition and Characteristics
  • 3、 Manufacturing process3、 Manufacturing process
  • 4、 Application Fields4、 Application Fields
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