Polyimide PCB manufacturing-深圳市海博精密电路有限公司

Press the polyimide material onto the copper foil and use a vacuum press to cure it at high temperatures within the specified time. The pressed laminated board is baked again at high temperature before entering the next process. Lay layers after dehumidification of laminated and pre impregnated materials.

The etching process is performed by coating a photoresist layer and exposing it to ultraviolet light through a masking process. Immerse the photoresist into a developing solution and then etch away unwanted copper material to create a copper pattern.

Drill holes and vias on polyimide PCB, and then perform electroplating to achieve cross layer electrical connections.

Then apply solder resistant material onto the polyimide PCB to prevent copper oxidation. Apply a solder mask layer onto the insulation layer to prevent bridging and short circuits.

The screen printing process involves printing information such as component codes, positions, and references on PCB polyimide using solder mask materials.

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Haibo is an expert in the field of FPC/PCB manufacturing and surface mount assembly in China. Since our establishment in 2017, we have been providing high-quality PCBs to over 1000 customers worldwide. Our factory has passed ISO14001, ISO9001:2015, TS16949, and ISO13485:2016 certifications. We are one of the most trusted small and medium-sized FPC/PCB manufacturers in China.

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Contact: Chen Changhai

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