4、 Manufacturing process-深圳市海博精密电路有限公司

The manufacturing process of soft hard composite boards is relatively complex, involving multiple steps and fine operations. The main processes include:
Design phase: Use CAD software for circuit design to ensure precise connection between rigid and flexible parts.
Material selection: Choose suitable substrates based on product requirements, such as PI (polyimide), FR4, etc.
Making conductive layer: Creating conductive patterns through photolithography process.
Layering and Drilling: The rigid and flexible layers are laminated and mechanically drilled at designated locations for subsequent installation of components or interlayer connections.
Electroplating and surface treatment: Plating a layer of copper on the hole wall through chemical plating or electrolytic plating to ensure reliable electrical connection. Treat the exposed copper surface to enhance welding performance and prevent oxidation.
Outer layer fabrication and flexible circuit fabrication: Create outer layer circuit patterns and protect the bending performance of flexible areas.
Combining process: Accurately align and bond the prepared flexible circuit with the rigid board, commonly using methods such as hot pressing bonding and adhesive bonding.
Testing and Inspection: Conduct circuit connectivity and functional testing to ensure product quality meets standards.

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