The PCB sensor board is the most accurate part of the system, involving multiple processes aimed at ensuring accuracy and high-resolution output. Let's delve deeper into the main operations:
1. Schematic design and layout preparation: Now, the designer needs to start drawing schematic diagrams, marking all element connection points and the functional conditions of these elements.
2. Material selection and stacking: Typically, material layers are stacked together; In this case, the stacked structure will include a copper conductive layer and a substrate used as an insulation layer, which are the basic elements that make up the sensor PCB.
3. Lithography: First, apply an appropriate photoresist on the substrate. Next, the circuit is first imprinted into the polymer through gentle ultraviolet irradiation. Then remove the uncovered structure, leaving only the remaining copper traces.
4. Layering and lamination: This process requires mixing several layers of cover with other insulation materials at high temperature and high pressure to bond all layers together through a single solid board.
5. Drilling and Electroplating: The installation position and via holes of through-hole components are pre created and drilled in the design based on precise design. The internal layers of the device from top to bottom are coated with copper, which helps to form conductive channels.
6. Component placement and welding: After this step, the assembled components are placed by an automatic machine using two main methods:
Surface Mount Technology (SMT):
SMT components are placed on the surface of the sensor PCB. This means that the setup can be very compact, making efficient use of performance and space.
Through hole technology:
This method is the same as drilling and welding all components from the other side, using resin of the same size and strength to achieve strong bonding for high-pressure applications.
7. Inspection and Quality Control: This program utilizes AOI (Automatic Optical Inspection) and X-ray testing during and after welding to confirm the accuracy of component placement and the quality of circuit board joints.
8. Functional testing: Functional testing is an electrical simulation of the working status of the sensor PCB. The purpose is to check the integrity of the circuit by verifying open circuit, short circuit, and resistance values.
9. Precision machining and cutting: Now apply a protective coating on the sensor PCB and cut it into individual units.
During these stages, quality control is very strict: the program includes online testing (ICT) and environmental stress testing, allowing us to ensure that the sensor PCB meets very qualitative requirements such as performance and durability. These processes aim to serve as guiding principles for the production of high-quality and reliable sensor PCB boards.
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