Although the options provided by a 6-layer PCB are very flexible, it requires high reliability and cost-effectiveness. Therefore, the designer's job is to use these layers wisely and effectively. Some key points to note before design are:
Layer arrangement: Power and ground layers are crucial for EMC and stable power distribution. The placement of grounding layers is particularly important for shielding and return paths. All high-speed signals require a ground layer to be placed underneath them for better impedance control and signal integrity. Signals sensitive to EMI are typically routed in an inner layer sandwiched between two ground planes to achieve optimal shielding.
High speed signal layout: For different high-speed signals, it is best to use two extreme layers, namely the top and bottom layers of each signal. This will increase insulation and reduce crosstalk between them.
Heat dissipation precautions: When designing PCB with dense components, it is important to maintain appropriate heat dissipation to achieve optimal component performance. Using materials with high conductivity and heavier copper in the main body can help with better heat dissipation. Using better materials and more copper weight in PCBs can even improve signal integrity.
Selection of core material and prepreg: There are also 5 layers of dielectric on a 6-layer PCB. The thickness and properties of dielectrics have a significant impact on EMC and impedance control calculations. The choice of dielectric type (prepreg and core material) and material type can also seriously affect the cost of 6-layer PCB. Suggest making a wise choice.
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