The following figure shows the defect: the ratio of width (W) to height (H) is greater than 2:1; The number of weldable end faces (metal cover ends) of the component is less than 3.
The following figure shows the defect: the material surface of the SMD component is exposed, with electrical materials piled up and installed on the circuit board of the PCB. This should be a process warning.
The following figure shows the defect: distortion at the end of the SMD component.
The ratio of width to height shall not exceed 2:1. The surface of the solder pad and the solderable end of the component are completely 100% wetted and in overlapping contact. The component has 3 or more solderable ends and good wetting properties on the vertical surface.
Attach the SMD component material surface without exposed electrical material accumulation onto the PCB surface.
End warping of SMD components (known as Tomstoning).
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