The width (C) of the end solder joint shall be at least 50% of the solderable end width (W) of the component or 50% of the pad width (P), whichever is smaller.
The minimum solder joint height (F) is 25% of the solder thickness (G) plus the solderable end height (H) or 0.5 millimeters, determined by the smaller of G and H.
The maximum height of a solder joint is the thickness of the solder material plus the height of the solderable end of the component.
The following figure shows the defect: the width of the solder joint is less than 50% of the width of the smaller solder joint.
The following figure shows the defects: no solder joint crawling height, insufficient solder, and no wet solder joints on the vertical surface of the solderable end of the component.
The following figure shows the acceptable welding situation: the maximum height of solder joint (E) can exceed the solder pad or extend to the top of the metal coating of the solderable end cap, but cannot extend to the top of the component body.
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