The advantage of multi-layer impedance FPC lies in its high performance, high-density interconnection, and flexibility, which can meet the demand of modern electronic devices for high-performance connections. Meanwhile, through precise impedance control, the quality and stability of signal transmission can be further improved. However, the manufacturing process of multi-layer impedance FPC is relatively complex, requiring high-precision process control and equipment support. In addition, with the rapid development and acceleration of electronic products, the performance requirements for multi-layer impedance FPC are also increasing, and traditional manufacturing processes are facing many challenges.
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