The structure of multi-layer impedance FPC usually consists of multiple conductive pattern layers, insulating dielectric layers, and necessary cover films and reinforcement materials. Its key characteristics are:
Multi layer structure: By stacking multiple layers of conductive patterns and insulating dielectric layers, more complex and dense circuit designs can be achieved, improving the efficiency and stability of signal transmission.
Impedance control: By accurately designing parameters such as the width and thickness of the conductive layer and the dielectric constant of the insulation layer, precise control of the circuit characteristic impedance can be achieved, thereby reducing signal reflection and distortion and improving the quality of signal transmission.
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