Technology
Electronic manufacturing industry
PCB manufacturing process

Inner layer production:Use photoresist exposed to ultraviolet light to etch the image in the virtual draft onto the substrate surface. The etching process is used to remove copper patterns that do not belong to the circuit.

Laminated:Multi layer PCB includes lamination process, using prepreg to connect the inner layers. Prepreg is a glass fiber material containing partially cured resin. The lamination process is carried out at specific temperatures and pressures to form rigid stacks.

Drilling:Drill holes on the PCB using reference drilling data. The drilling size is automatically selected and then moved to the drilling position.

Through hole electroplating:Clean the drill holes to increase adhesion during copper plating. Copper plating is used to provide conductive tracks on PCBs and through holes and vias.

Outer layer image:The method of inner layer manufacturing is almost similar, where the photoresist film is removed where copper circuits need to be formed, and then developed again and exposed to ultraviolet light.

Solder mask:A solder mask must be applied on the PCB substrate to separate the conductive pads from the insulating surface. Liquid photosensitive imaging solder mask is the most common type, in which a photoresist mask is used to generate patterns through UV exposure, mask development, and curing.

Surface treatment:Metal copper pads should be protected from external factors through surface treatment techniques such as hot air solder leveling (HASL), organic solderability (OSP), and electroless nickel immersion (ENIG). The purpose of these methods is to apply a thin film or a protective layer on the surface to prevent oxidation.

Screen printing:PCB contains alphanumeric codes, reference points, labels, and references, which assembly stations use to verify component positions and packaging. These pieces of information are integrated into printed circuit boards through liquid light imaging technology, where liquid epoxy resin is applied and then exposed to ultraviolet light for development and curing.

Testing:Bare printed circuit boards should be tested to check the continuity of the circuit and identify electrical faults such as open circuits and short circuits.

  • Basic Electronic Manufacturing ProcessBasic Electronic Manufacturing Process
  • PCB assembly processPCB assembly process
  • Advantages of Electronic Manufacturing ServicesAdvantages of Electronic Manufacturing Services
  • Why choose Haibo as a suitable electronic manufacturing company?Why choose Haibo as a suitable electronic manufacturing company?
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