Choose suitable substrates, such as polyimide (PI) or polyester (PET) films, which have good flexibility and heat resistance. Covering the surface of the substrate with a layer of copper foil, the thickness of the copper foil is usually between 12 μ m and 35 μ m, depending on the current demand and design requirements.
Line production
Transfer circuit patterns onto copper foil using photolithography. Firstly, a layer of photoresist material is coated on the copper foil, and then the circuit pattern is exposed onto the photoresist layer through a photomask. Etch the exposed copper foil to form the desired circuit pattern. Etching accuracy is crucial for the performance of circuit boards.
Layering and Drilling
For multi-layer FPCs or FPCs that require interlayer connections, they need to be laminated together through a lamination process. Process through holes using laser drilling or mechanical drilling to achieve electrical connections between layers.
Electroplating and surface treatment
Perform electroplating treatment on the drilled through holes to ensure electrical connection between layers. Surface treatment of FPC to improve soldering performance and oxidation resistance. Common surface treatment processes include chemical gold plating, silver plating, or organic solder mask (OSP) treatment.
Forming and cutting
Cover the circuit layer with an insulating film to protect the circuit and prevent short circuits and external damage. Separate the finished product from the entire substrate using methods such as punching or laser cutting, and cut it into a shape that meets the design requirements.
Testing and Inspection
Conduct strict electrical performance testing, bending testing, tensile strength testing, etc. on FPC to ensure that the conductivity, solderability, and structural integrity of the circuit meet the design requirements.
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