The application of 3D printing technology in FPC manufacturing is gradually emerging, which allows designers to freely design circuits based on the shape and functional requirements of the product, without being limited to planar structures.
3D printing technology can reduce material waste and processing steps, improve production efficiency, and reduce costs.
With the increasing demand for conductive materials, new materials such as graphene and nanosilver are gradually receiving attention. These materials have higher conductivity and flexibility, making them particularly suitable for applications that require higher conductivity, such as flexible displays and wearable devices.
Compared to traditional mechanical cutting and drilling, laser processing has higher precision and can achieve smaller apertures and finer lines, meeting the requirements of high-density interconnect (HDI) design.
With the increasing awareness of environmental protection, FPC manufacturing processes are paying more and more attention to the use of environmentally friendly materials and processes to reduce their impact on the environment.
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