After generating the design schematic and layout, send the Gerber file containing layer stacking information and other manufacturing instructions to the rigid flexible PCB manufacturer for rigid flexible PCB manufacturing. The following is an overview of different rigid flexible PCB manufacturing processes.
Layering: The flexible layer is laminated together with the rigid part through adhesive bonding, heating, and pressure. The flexible circuit is composed of polyimide core, adhesive, and copper film, while the rigid part is composed of FR4 substrate, copper, and solder mask layer. PCB flexible and rigid materials must be strictly bonded according to specifications.
Drilling: The drilling process can be completed by mechanical or laser drill bits. The received Gerber file is used as a reference for hole positions. Drilling is usually the slowest process in the entire rigid flexible PCB production line. It is very important to minimize drilling burrs during the drilling process. Clean burrs and debris using standard methods.
Copper plating: Drills (also known as "vias") are plated with copper to provide electrical connections across layers.
Etching: During the etching process, copper traces that do not belong to the circuit layout will be removed from the substrate. The etching process is completed through photolithography technology, in which a mask pattern is used to expose and develop photosensitive materials and etch away unwanted copper surfaces.
Solder mask: The green coating you typically see on a PCB is a product of the solder mask process. The solder mask layer on the PCB serves not only as a protective layer, but also as an isolation layer and insulation layer. It isolates conductive pads to avoid short circuits between adjacent pads.
Surface treatment: Apply a protective layer on the copper pad to provide a solderable contact pad and protect the copper from oxidation. The most common surface treatment techniques include electroless nickel immersion (ENIG), organic surface protection (OSP), and hot air solder leveling (HASL).
Screen printing: A layer of screen printing that displays reference marks, manufacturing and assembly instructions, traceability, and other information is printed on a rigid flexible printed circuit board. This can be achieved through photolithography, where photosensitive materials are used to create patterns, or through direct laser printing.
Electrical testing: Electrical testing is conducted in the later stages of the rigid flexible PCB manufacturing process to ensure that only defect free products can be delivered to customers. The latest testing technology makes it possible to automatically test the continuity of circuits using Pogo needle fixtures.
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