High density interconnect PCBs are used daily for various complex system based applications, such as personal computers, mobile phones, tablets, cameras, and supercomputer systems like space stations.
Size and weight: Due to the space occupied design and complexity of the circuit board, compact size and lightweight are the main advantages, which retain the functional features of the overall situation. Low cost: Manufacturing costs may seem high, but when the entire standard PCB design is considered from a component and size perspective, this can reduce the cost of the entire application several times. Performance and reliability: HDI circuit boards offer higher performance with less noise and signal integrity issues. Although the component packaging is small and the spacing is also small, the performance of HDI is still reliable. The use of micro through holes and buried holes instead of through holes can provide greater advantages for high-density interconnect boards. The smaller size with aspect ratio provides additional advantages. Through hole pad technology provides higher signal integrity while reducing signal path length. Time to market: The production process of high-density interconnect PCBs exhibits excellent performance, enabling production and testing of compact applications in less time.mobile phone: 86-15113315665
Contact: Chen Changhai
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