There are some significant differences in manufacturing processes between standard PCBs and HDI printed circuit boards. The manufacturing capability of these designs should not be a bottleneck for any feasibility issues, as it may affect the performance and accuracy of the PCB. PCB design software will be able to handle any smaller components or design constraints, but the design must be compatible with manufacturing, which is a requirement for Design for Manufacturing (DFM). Before designing a circuit board, the following substrate precautions must be considered.
The core material of HDI printed circuit boards should be able to handle electrical and mechanical properties related to substrate characteristics.
The adhesion between copper and dielectric materials, as well as the reliability of their performance, should also be considered.
The dielectric spacing between conductive layers should be stable.
Dielectric materials should be able to meet thermal requirements.
The dielectric material of HDI printed circuit boards should be able to provide high TG and metal contacts, wire bonding, or any rework applications.
The material or substrate should be able to withstand thermal cycling or thermal shock during or after the manufacturing process.
The dielectric should be able to handle hot holes, micropores, buried holes, or blind holes.
The IPC standards that support and assist in selecting standards are IPC-4101B and IPC-4104A. The materials include photosensitive liquid dielectric, photosensitive dry film dielectric, polyamide flexible film, thermosetting dry film, thermosetting liquid dielectric, resin coated copper foil, standard FR-4 substrate, glass layable drillable (LD) prepreg, and thermoplastic.
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