The manufacturing process of HDI soft hard composite board is relatively complex, involving multiple steps and fine operations. The main processes include:
Design: Use advanced CAD software for circuit design, ensuring precise docking between rigid and flexible areas and achieving high-density interconnection.
Material selection: Choose suitable substrates and conductive materials according to product requirements, such as rigid substrates like polyimide (PI) and FR4, as well as flexible materials like transparent conductive films.
Making conductive layer: Using photolithography, electroplating and other processes to create conductive patterns and vias on the substrate.
Layering and Drilling: The rigid and flexible layers are laminated and mechanically drilled at designated locations for subsequent installation of components or interlayer connections.
Electroplating and surface treatment: Electroplating treatment is applied to the exposed copper surface to enhance welding performance and prevent oxidation.
Testing and Inspection: Conduct circuit connectivity and functional testing to ensure product quality meets standards.
mobile phone: 86-15113315665
Contact: Chen Changhai
mobile phone: 86-18676922028
E-mall: haibo_fpcba1668@163.com
Address: 3rd Floor, Building 2, Fuxing Industrial Park, Building B, Chuangye 1st Road, Jiangbian Community, Songgang Street, Bao'an District, Shenzhen