According to market research reports, the market for non adhesive polyimide copper-clad laminates is expected to maintain stable growth in the coming years. This is mainly due to the following factors:
Technological innovation: With the continuous progress and innovation of technology, the performance of non adhesive polyimide will be further improved to meet the application needs of more fields.
Environmental requirements: With the increasing awareness of environmental protection and the increasingly strict environmental regulations, the environmental advantages of non adhesive polyimide will become more apparent, promoting its application in the market.
The growth of the consumer electronics market: The sustained growth of the consumer electronics market provides a broad application space for non adhesive polyimides.
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