1、 Definition and Performance Characteristics-深圳市海博精密电路有限公司

Non adhesive polyimide is a high-performance flexible circuit board material that eliminates the adhesive layer in traditional adhesive coated copper sheets, resulting in superior electrical performance and thermal stability. This material has the following significant performance characteristics:
High thermal stability: Non adhesive polyimide can maintain stable physical and chemical properties in high temperature environments, and its thermal deformation temperature is usually in a high range, which makes it perform well in high-temperature applications.
Excellent electrical performance: Non adhesive polyimide has a very low dielectric constant and high dielectric strength, making it an ideal choice for electrical insulation materials. Its excellent electrical insulation performance is particularly important in high-frequency, high-power, and high-density wiring applications.
Good mechanical strength: Non adhesive polyimide has high tensile strength and toughness, can resist external impact and tearing, and is suitable for use in harsh environments.
Environmental friendliness: The manufacturing process of non adhesive polyimide does not use adhesives, making it more environmentally friendly than adhesive three-layer flexible copper-clad laminates, which is in line with the current trend of green and environmental protection industry development.

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