Drilling and etching methods in micro porous PCB manufacturing
At present, the commonly used methods for PCB micro hole processing include mechanical drilling, laser drilling, plasma etching holes, chemical etching holes, etc.
Mechanical drilling
Mechanical drilling is the use of high-speed machines for processing, and the most important component is the drill bit. The drill bit is generally made of tungsten cobalt alloy, which is made of tungsten carbide powder as the matrix, cobalt as the binder, and sintered at high temperature and high pressure. It has extremely high hardness and wear resistance, and can smoothly drill the holes required for micro hole PCB production.
laser drilling
Laser drilling is the use of carbon dioxide and ultraviolet laser to cut the required holes. The light beam formed by gas or light has very strong thermal energy, which can burn through copper and obtain the desired holes. The principle is the same as cutting, mainly controlling the beam of light. Laser drilling is currently widely used for micro hole drilling in HDI PCB manufacturing.
Plasma etching hole
Plasma etching holes have a large spacing between plasma particles and are in an irregular continuous collision state. Their thermal motion is similar to that of ordinary gases. Plasma etching holes are mainly used in the resin copper layer of PCBs, using oxygen-containing gases as plasma. After the plasma contacts the copper, oxidation reaction occurs, removing the resin material and forming the required holes.
Chemical etching hole
Chemical etching holes, just like residual substances on PCBs, cannot be cleaned by ordinary methods, only chemical cleaning methods can be used. Chemical agents react with residues and then remove them. So chemical etching holes are the same, using chemical agents to drip into the location where the hole needs to be drilled, and then etching copper, resin, etc. In the end, it became a hole.
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