In order to protect our environment, countries around the world advocate for green products, so more and more PCB factories will produce more FPC products with lead-free hot air solder layer surface treatment. The SMT factory will choose to use lead-free hot air solder layer FPC to supply RoHS circuit boards.
From a technical perspective, many countries attach great importance to lead-free technology. Many countries have specialized institutions for the research and development of lead-free solder, which collaborate with solder manufacturers to develop various lead-free solder materials, and a considerable number of them have been experimentally proven to replace tin lead solder products. The focus of lead-free solder research is:
Some people have concerns about whether factories will add new toxic and harmful substances to lead-free solder to remove lead. I understand this concern. We should recognize that such an approach is absurd, unacceptable, and goes against environmental requirements. Some people have the view that "although we should pay attention to whether it meets environmental requirements, can we underestimate its weldability and post weld reliability?" The answer is of course "NO. Moreover, some people are concerned about the cost-effectiveness of lead-free solder. From the above discussion, we can know what kind of lead-free solder will be more popular.
In terms of equipment, lead-free solder factories also have wave soldering and reflow soldering equipment, but many lead-free solder research and development institutions and manufacturers are still striving to improve the quality parameters of lead-free solder itself to adapt to customers' existing equipment.
The newly developed lead-free solder should be as compatible as possible with various fluxes, and the compatibility should be as strong as possible. It should not only work with the support of active rosin resin flux (RA), but also be used for mild, weak active rosin flux (RMA) or resin free cleaning flux, which is the future development trend.
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