X-ray testing does not require any physical contact with the circuit board or its components, making it a non-invasive testing method that can be used for complex PCBs and PCB components. X-ray inspection is an advanced automatic optical inspection (AOI) technology used to detect internal solder joints in PCB components. X-ray inspection uses X-rays to scan PCBs, allowing for a detailed and accurate view of the wiring/solder connections inside the circuit board. This imaging can quickly and easily identify defects in solder joints, through holes, and other features.
X-ray inspection has non-contact and high-resolution functions, and is the preferred automatic optical inspection technology for verifying the quality of internal connections under the surface of PCBs and PCB components. At Haibo, we will conduct X-ray inspection to check the solder joints of special components such as BGA and flip chip.
Whether it is electronic testing for open/short circuits, automatic optical inspection (AOI) to detect component accuracy, ICT (in circuit testing) to detect electrical connections, or FCT (functional testing), we can see and contact PCB surfaces or solder joints. But for some special components, such as BGA and flip chip, we cannot see the solder joints with the naked eye. In this case, we need to use X-rays to check the internal connections of the solder joints.
mobile phone: 86-15113315665
Contact: Chen Changhai
mobile phone: 86-18676922028
E-mall: haibo_fpcba1668@163.com
Address: 3rd Floor, Building 2, Fuxing Industrial Park, Building B, Chuangye 1st Road, Jiangbian Community, Songgang Street, Bao'an District, Shenzhen