Technology
PCB control impedance
Impedance matching of PCB manufacturers

Before production, engineers from the PCB manufacturing company will review the Gerber files and recommend suitable materials and stacking to meet the customer's impedance requirements. Please refer to the following impedance matching techniques provided by our engineers for control.

Dielectric thickness and appropriate stacking

Increasing the thickness of the medium can increase the impedance value, while reducing the thickness of the medium can decrease the impedance value. Engineering design, laminated board pressing control, and incoming material tolerance are key factors in controlling the thickness of the medium.

The width/spacing of the conductor meets the impedance value

Increasing line width can reduce impedance, while reducing line width increases impedance. The line width is mainly controlled through etching and design.

The thickness of the conductor meets the impedance value and can also be produced

Reducing the thickness of the conductor can increase the impedance value, while increasing the thickness of the circuit can reduce the impedance. The thickness of the wire can be controlled by graphic electroplating or selecting the corresponding thickness of the base copper foil.

The thickness of the solder mask layer meets the impedance value and can also be produced

Generally speaking, printing a solder mask on a PCB will reduce the impedance value: the single end will decrease by 2 ohms, and the difference will decrease by 8 ohms. Two solder mask layers will reduce the impedance by two times. Printing the solder mask layer three or more times should help reduce the impedance value.

  • Theoretical basis for impedance controlTheoretical basis for impedance control
  • Classification of impedance controlClassification of impedance control
  • How to test impedance valuesHow to test impedance values
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