Surface Treatment | Storage conditions and shelf life (from production date) | Storage conditions and workshop lifespan after unpacking | ||
---|---|---|---|---|
Storage situation | quality guarantee period | Storage situation | Workshop Life | |
immersion silver | Temperature ≤ 27 ℃, humidity ≤ 60%, no acid, alkali or organic solution | 6 months | Temperature ≤ 27 ℃, humidity ≤ 60%, no acid, alkali or organic solution | ≤ 48 hours |
(OSP) Organic Solderability Protective Agent | Temperature ≤ 27 ℃, humidity ≤ 60%, no acid, alkali or organic solution | 6 months | Temperature ≤ 27 ℃, humidity ≤ 60%, no acid, alkali or organic solution | ≤ 24 hours |
ENIG,ENEPIG, gold-plating | Temperature ≤ 27 ℃, humidity ≤ 60%, no acid, alkali or organic solution | 12 months | Temperature ≤ 27 ℃, humidity ≤ 60%, no acid, alkali or organic solution | ≤ 24 hours |
Tin immersion | Temperature ≤ 27 ℃, humidity ≤ 60%, no acid, alkali or organic solution | 6 months | Temperature ≤ 27 ℃, humidity ≤ 60%, no acid, alkali or organic solution | ≤ 24 hours |
(HASL) Hot air soldering and leveling machine | Temperature ≤ 27 ℃, humidity ≤ 60%, no acid, alkali or organic solution | 12 months | Temperature ≤ 27 ℃, humidity ≤ 60%, no acid, alkali or organic solution | ≤ 24 hours |
Attention: For HDI boards, if the storage time exceeds three months but is less than six months, the PCB needs to be baked before production and assembled within 8 hours
Silver immersed PCB baking temperature 120 ± 5 ℃, 2 hours, stacking height ≤ 2.5cm;
Whole board nickel gold PCB baking temperature: 120 ± 5 ℃, 2-4 hours, stacking height ≤ 2.5cm;
The baking temperature for OSP surface treatment and selective OSP surface treatment PCB is 120 ± 5 ℃, 2 hours, and the stacking height is ≤ 2.5cm.
The oven must be kept clean and free of volatile gases such as corrosive chemicals such as acids, alkalis, and organic solvents.
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Contact: Chen Changhai
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