In 1925, Charles Ducas of the United States invented printing wires on insulating substrates to replace wire connections, and later adopted electroplated copper wires, marking the beginning of PCB manufacturing.
In 1936, Austrian Paul Eisler invented printed circuit boards and applied them to radio equipment.
In 1947, epoxy resin was used as the substrate in the manufacturing of PCB printed circuit boards.
In 1948, the United States officially recognized the invention of printed circuit boards and used them for commercial purposes.
In 1953, Motorola developed a double-sided board using electroplating through-hole method, which was later applied to the manufacturing of multi-layer printed circuit boards.
In 1960: V. Dahlgren invented flexible printed circuit boards by attaching copper foil to flexible plastic materials. This pioneered the use of flexible materials to manufacture PCBs.
In 1961, Hazeline Corporation in the United States began manufacturing multi-layer PCBs using through-hole electroplating technology. This is a major advancement in PCB manufacturing, as very complex functions can be integrated into multi-layer circuit boards.
In 1995, Panasonic developed arbitrary layer drilling in multi-layer DHI printed circuit boards. Stacked vias are used to meet the connection requirements of any layer.
In 1996, Toshiba developed B2IT multilayer printed circuit boards. Toshiba has developed B2IT multi-layer printed circuit boards. Later, this technology was widely accepted in the PCB board manufacturing industry.
In 2000, new technologies such as rigid flex boards, buried resistors, buried capacitors, and IC carrier boards were being introduced into PCB manufacturing.
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