Adhesive free polyimide is a high-performance polymer material with excellent thermal stability, mechanical properties, dielectric properties, and chemical stability.
Performance characteristics:
Thermal stability: The thermal decomposition temperature of non adhesive polyimide is usually above 500 ℃, which can maintain stable performance for a long time in high temperature environments. Mechanical performance: It has high tensile strength and bending strength, and can withstand large external forces without being easily broken or damaged. Dielectric performance: It has low dielectric constant and dielectric loss, as well as high dielectric strength, suitable for high-frequency and high-speed circuits. Chemical stability: It has good resistance to many chemical substances and is not easily corroded by acids, bases, salts, and other chemical substances.
Application:
Non adhesive polyimide is widely used in aviation, aerospace, microelectronics, nanotechnology, liquid crystals, separation membranes, lasers, and other fields. In the field of electronics, adhesive free polyimide can be used as insulation and protective layers for high-density electronic circuit boards, as well as packaging materials for solar panels and battery packaging.
comparative
Heat resistance: The glass transition temperature of TG150FR4 is 150 ℃, while the thermal decomposition temperature of non adhesive polyimide is usually above 500 ℃. Therefore, at extremely high temperatures, the heat resistance of non adhesive polyimide is superior to TG150FR4. Mechanical properties: Non adhesive polyimide has high tensile and bending strength, while TG150FR4 may have some mechanical properties, but it may be slightly inferior in comparison. Chemical stability: Both have good chemical stability, but the corrosion resistance of non adhesive polyimide may be more extensive. Application areas: TG150FR4 is mainly used for manufacturing printed circuit boards, while adhesive free polyimide is widely used in multiple high-tech fields, including aviation, aerospace, microelectronics, etc.
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