The manufacturing process of transparent FPC is relatively complex, mainly including the following steps:
Material preparation: Select suitable transparent substrates and conductive materials, and prepare the raw materials to be produced according to the design drawings.
Circuit fabrication: Creating predetermined circuit patterns on substrates through processes such as photolithography and etching.
Layering and Covering: The conductive circuit is laminated with a transparent substrate and covered with a transparent film on the outer layer to protect the circuit.
Drilling and Electroplating: Drill through holes or installation holes as needed, and perform electroplating treatment on the hole walls.
Surface treatment: Anti oxidation treatment is applied to the surface of the circuit board to improve its corrosion resistance and weldability.
Molding and cutting: Cut the transparent FPC according to the specified size based on the designed shape to form the final board shape.
Testing and Inspection: Conduct electrical performance testing and visual inspection on the formed transparent FPC to ensure that it meets design and quality standards.
mobile phone: 86-15113315665
Contact: Chen Changhai
mobile phone: 86-18676922028
E-mall: haibo_fpcba1668@163.com
Address: 3rd Floor, Building 2, Fuxing Industrial Park, Building B, Chuangye 1st Road, Jiangbian Community, Songgang Street, Bao'an District, Shenzhen