The manufacturing process of microporous FPC mainly includes the following steps:
Substrate preparation: Select a suitable flexible substrate, such as polyimide or polyester film, and clean and treat it.
Drilling: Advanced drilling techniques such as laser drilling, plasma etching, or chemical etching are used to form tiny pores on the substrate. These techniques can ensure the accuracy and consistency of aperture, while reducing damage to the substrate.
Circuit fabrication: Coating or depositing conductive material on the substrate after drilling to form a conductive layer. Then, the required circuit patterns are fabricated through processes such as photolithography and etching.
Cover film bonding and reinforcement: The cover film is bonded to the surface of the circuit to protect it, and reinforcement materials are attached to areas where support strength needs to be increased.
Cutting and Forming: Cut and form FPC according to design requirements to meet practical application needs.
Testing and Inspection: Conduct testing and inspection on the completed microporous FPC to ensure its quality and performance meet the requirements.
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Contact: Chen Changhai
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E-mall: haibo_fpcba1668@163.com
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