Unqualified: There are fingerprints on the board surface; Copper surface corrosion affects performance.
Qualified: No indentation or indentation does not cause bridging between conductors; Indentation will not cause a reduction in line spacing of less than 20% for exposed burst fibers, and the medium thickness is equal to or greater than 0.09mm.
Unqualified: The distance between external impurities, garbage particles, and the nearest conductor is close to 0.125mm. The size has exceeded 0.8mm.
Unqualified: Scratches on the solder mask layer result in exposed copper, exceeding the above regulations.
Acceptable: Non sensitive scratch solder mask layer will not cause copper or metal exposure; The appearance is not obvious.
Unqualified: The indentation causes the exposed burst fibers to reduce the row spacing by more than 20%, and the medium thickness is less than 0.09mm.
Unqualified: The board surface exhibits cracking, delamination, blistering, and other phenomena.
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