Unqualified: solder pad on Wuxi; The desoldering area of the solder pad is greater than 5%.
unqualified: The indentation and edge defects of BGA pads are greater than 10% of the pad diameter; The defect is greater than 20% of the circumference of the connecting pad.
Unqualified: There is ink on the solder pad, which affects the soldering performance.
Unqualified: The scratch gap on the solder pad exceeds 20% of the size.
Unqualified: The solder pads have phenomena such as oxidation, missed plating, and plating peeling, which affect the welding performance.
Unqualified: The gasket is twisted and defective.
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