Unqualified: The solder mask layer is offset. On solder pads with a spacing greater than 1.25mm, the solder mask layer deviates by more than 0.05mm; On solder pads with a spacing greater than 0.65mm and less than 1.25mm, the solder mask layer shows an offset of more than 0.025mm.
Unqualified: The solder mask ink wrinkled, resulting in copper exposure.
Unqualified: Poor exposure of solder mask layer; The pad size is less than 20%.
Unqualified: Bubbles and oil droplets appear on the solder mask layer, with more than 25 pieces on each side exceeding 0.25mm or more than XNUMX% of the circuit spacing.
Unqualified: Stripping of solder mask layer leads to copper exposure; The solder mask ink is broken, and the distance between the broken part and the nearest conductor exceeds 50%.
unqualified: The characters on the PAD are blurry and difficult to recognize.
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