Technology
Acceptance criteria for PCBA
Welding abnormalities: pinholes/pores, cold welding, non wetting

Goal: Keep the solder joints moist. No pinholes/pores.
Objective: The solder joints are wet.
Objective: The solder joints are wet.
The following figure shows a process warning defect: pinholes/air holes.
The following figure shows the defect: incomplete reflow of solder paste.
The following figure shows the defect: the pins or pads to be soldered are not wet or semi wet.
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