People interested in VIPPO technology may ask, 'If my PCB requires drilling holes on solder pads and soldering electronic components on them, do I need to use VIPPO technology or SKIPPO?' Yes, you understand. By the way, VIPPO and SKIPPO (Skip Via in Pad Plated over) are commonly used for through holes in BGA solder pads.
Many people may wonder, "What if there are through holes on the solder pads and VIPPO is not printed on the PCB If POFV is not drilled on the via holes on the solder pad, it means that not plugging the via holes will result in a small welding area, leading to tin ball hole accumulation or oil explosion, resulting in welding failure.
It is best not to exceed 0.5mm in VIPPO aperture, otherwise solder paste is prone to flow into the hole, or during heating, solder flux is prone to flow into the hole, causing gas inside the hole and resulting in insufficient connection strength.
The production process of through-hole coating is shown in the following figure. The difference between VIPPO through-hole and regular through-hole is that it has a copper cap that is flush with the solder pad.
If VIPPO technology is used for PCB, the cost will increase by 15% -25%, and the solder pads are more prone to detachment than conventional pads, so it is recommended to choose packages with larger pin spacing. Some people may ask, "Why do we still use Platform Over Filled Via to plug holes?" This is because VIPPO technology greatly improves the wiring density of PCBs, especially in BGA areas, while also eliminating capacitance effects. Usually, the formation below BO/BO will produce capacitive effects. VIPPO technology eliminates the capacitance effect.
In addition, we suggest using through-hole plating technology combined with back drilling process, which can well meet the requirements of high-density and high-speed signal products.
So whether to adopt VIPPO technology or not requires a comprehensive evaluation based on the characteristics of the product.
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