VIPPO via pad coating technology:Simply put, after copper is applied to the wall of the hole, the guide hole is filled with epoxy resin, then the surface is polished, and finally copper plated on the surface. The cost is relatively high. It should be noted that some blind hole products have a blind hole layer thickness exceeding 0.5mm, and the pressed PP adhesive cannot fill the blind hole. It is also necessary to fill the blind hole with resin to avoid the problem of no copper in the blind hole in subsequent processes.
The difference between solder mask plug hole technology and plating filling hole technology:Before the widespread adoption of VIPPO plug hole technology, high-frequency PCB manufacturers generally used the simpler process of solder mask plug hole technology. However, when solder mask plug holes are used, the solder oil will shrink after solidification, which easily leads to hole explosion problems and cannot meet customers' requirements for high hole fullness.
On the other hand, VIPPO plug hole technology uses resin to plug blind holes, followed by a pressing process, perfectly solving the drawbacks of solder mask plug holes and balancing the contradiction between controlling the thickness of the pressing medium layer and the early design of the inner blind hole sealing and filling. Therefore, although VIPPO plug hole technology has a relatively complex process and high cost, the fullness and quality of plug holes will be more advantageous than solder mask plug holes.
Solder plug hole technology:Solder plug holes are used as ordinary vias on PCBs; After passing through the solder mask, there is solder oil on the surface, which cannot conduct electricity. General requirements after plugging:
A. Please make sure to fill in.
B. No redness or false copper exposure is allowed.
C. It is not allowed for the plug-in to be too neat and cause protrusions that protrude from nearby solder pads, which may affect SMT installation.
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