VIPPO plugging method-深圳市海博精密电路有限公司

The VIPPO sealing method is a revolutionary technology that provides PCB designers with excellent performance and reliability. This method allows for fast, efficient, and cost-effective assembly of PCBs without the need for solder paste or traditional through-hole assembly techniques. The POFV through-hole plating process on solder pads also eliminates the risk of thermal damage associated with soldering, and due to the smaller diameter of the through-hole, allows for higher component density to be installed on PCBs, making it an ideal choice for high-density applications such as smartphones, tablets, and other consumer electronics devices.

The VIPPO plug hole process can assemble PCBs without the need for solder paste or traditional through-hole assembly techniques. In this process, the conductive vias are integrated into the printed circuit board, and then filled with non-conductive materials such as epoxy resin or insulating gel. It creates a practical and safe plug that can connect electrical components to circuit boards without the need for traditional through-hole assembly techniques. In addition, the through-hole diameter used in this method is smaller than traditional through-hole assembly methods, allowing designers to increase the density of components on the PCB. Therefore, the POFV plug hole method provides excellent performance and reliability for PCB designers, making it an ideal choice for high-density applications.

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