Technology
Acceptance criteria for PCBA
Flat, L-shaped, and wing shaped pins, minimum height of heel solder joint, pin coplanarity

The height of the solder joint at the heel (F) is greater than the solder thickness (G) plus the pin thickness (T), but does not extend to the radius of the knee bend.
Components with neatly arranged pins (coplanar) to accept soldering formation
The following figure shows an acceptable situation: the minimum height (F) of the solder joint at the heel is equal to 50% of the solder thickness (G) at the connection point plus the pin thickness (T).
The following figure shows the defect: the minimum height (F) of the solder joint at the heel is less than 50% of the solder thickness (G) at the connection point plus the pin thickness (T).
The following image shows a defect: one or more pins of the component are misaligned and not in proper contact with the solder pads.
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