When the pin length (L) is less than three times the pin width (W), the minimum length (D) of the side solder joint is equal to 100% of (L).
When the pin length (L) is greater than 3 times the pin width (W), the minimum length (D) of the side connector is greater than or equal to 3 times the pin width (W) or 75% of the pin length (L), whichever is larger between (L) and (W).
The solder joint at the heel exceeds the thickness of the pin, but does not fill the bend of the pin.
There is no solder on the component body.
When the pin length (L) is greater than three times the pin width (W), and the minimum length (D) of the side solder joint is less than three times the pin width (W) or 75% of the pin length (L), the larger of (L) and (W) shall prevail.
When the pin length (L) is less than three times the pin width (W), the minimum length (D) of the side solder joint is less than 100% of (L).
The following figure shows an acceptable situation: there is solder on the plastic component body, such as SOIC or SOT.
There is no solder on the ceramic or metal component body.
The following figure shows the defect: there is solder on the main body of plastic components other than SOIC or SOT.
There is no solder on the ceramic or metal component body.
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