Precautions for IC carrier PCB design-深圳市海博精密电路有限公司

When it comes to IC substrate design, design considerations are crucial for understanding various parameters such as material composition, alloy type, lamination, lead, and substrate type. Adhesive tape and rigid substrates also have different characteristics, which provide necessary performance, reliability, lifecycle, and durability for applications.

Material composition: IC carrier boards are composed of different electrical, mechanical, and chemical properties. The material of the lead frame is made of gold or silver and connected by spot welding. The lead frame and laminated packaging are made of the same material.

Alloy: The solder pad is protected by plastic packaging, providing relative permeability for performance, especially for surface mount packaging.

Terminal: The terminal cannot match the performance of tin or other materials, and the industry uses gold or silver coating packaging to comply with industry standards. The operating frequency is mainly affected by the selection of leads.

Laminated materials: The laminating technology on ceramic substrates and the technology applicable to organic substrates not only have high temperature resistance (thermal reliability), but also have lower costs. Electrical durability is higher than other ceramic substrates.

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